شنبه، 1 مهر 1396 تماس با ما نقشه سایت صفحه اصلی English
 
 
 
 
     

حبیب بدری قویفکر
مرتبه علمی :دانشیار
تخصص : Microelectronics
زمینه های تحقیقاتی : Microsystem Technologies, Microelectronic Packaging Technologies, Microelectromechanical Systems (MEMS) Technology of Semiconductor Devices Electronic Measurement and Instrumentation
مراکز تحقیقاتی :Microelectronic Research Center

پست الکترونیکی: badri@sut.ac.ir
شماره تلفن: 04113459375
شماره فکس: 04113444322
رزومه:
Professional Experience:
 

1998 - 2005     Research Assistant       Fraunhofer Institute IZM, Berlin / Germany

                                                                Institute for Reliability and Microintegration

Field of Activities:          Microsystem Technologies, Microelectronic Packaging Technologies

 

 

1994 - 1996     Technical Assistant      Fraunhofer Institute IZM, Berlin / Germany

                                                                Institute for Reliability and Microintegration

Field of Activities:          Microelectronic Packaging, Laser Montage Technique FPC

1996 - 1998     Scientific Assistant      Berlin University of Technology / Germany

                                                               BeCAP: Berlin Center of Advanced Packaging

Field of Activities:          Microsystem Technologies
 

1993                 Technical Trainee        Berlin University of Technology / Germany

                                                               MAT: Microsensor and Actuator Technology

Field of Activities:          MEMS, Manufacturing of mSensors
 

1991 - 1993     Technical Assistant      Andus Electronics, Berlin / Germany

Field of Activities:          Printed Circuit Boards

 

Education:
 

 

PHD.                            Electrical Engineering  

Feb. 2004                     Berlin University of Technology / Germany

 
Field of Research:          Microsystem Technologies

Thesis:                          Application of fracture mechanical integral concepts on the

                                     thermo-mechanical reliability estimation by microelectronic

                                     packaging technology

 

BSC. & MSC.             Electrical Engineering

Jan- 1996                     Berlin University of Technology / Germany

 
Fields of Study:             Microsystem Technologies

                                      - Microelectronic Packaging Technologies,

                                      - MEMS Technology (Design and Fabrication of mSensors),

                                      - Integrated Circuit

 

Thesis 1:    Design and Manufacturing of a Silicon based Pressure mSensor

Thesis 2:    Finite Element Analyze and Optimization of the Laser Montage Method FPC

 

BSC.   Oct. 1988         Electrical Engineering
                                    Tabriz University /  Iran
 
Field of Study:              Electronics
 

Language:
 
 
German, English, Farsi, Turkish (Azari) 

Teaching Experience:
 
 
Assistant Professor, Sahand University of Technology, Tabriz, Iran,
Since Sep. 2005.
 
- Theory and Technology of Semiconductor Devices  (M.Sc.)
- Microelectromechanical Systems MEMS  (M.Sc.)
- Advance Electronic Measurement Techniques I, II  (M.Sc.)
- Electronic Measurement Techniques  (B.Sc.)
- Instrumentation  (B.Sc.)
- Engineering Electromagnetics  (B.Sc.)

M.Sc. Thesis Supervised:

1                   W. Tahmasbi;High Directive Microstrip Antenna using Metamaterials, Design and Construction”, Co-supervisor: Dr. G. Dadashzadeh, Sahand University of Technology, 2007

2                   M. Mottaghi;Design of a Sensor based on MEMS Technology for Integration into Surgical Handpiece”, Co-supervisor: Dr. F. Ghalichi, Sahand University of Technology, 2009

3                   M. Baghelani; “A New High Reliable Structure of Microelectromechanical Radial Contour Mode Disk Resonator for UHF Application”, Sahand University of Technology, 2009

 

Publications:

1                   M. Mottaghi, F. Ghalichi, H. Badri Ghavifekr; Design of a MEMS Sensor for Surgical Handpiece, International Conference on Microelectronics ICM08, Sharjah, UAE, 2008

2                   M. Mottaghi, F. Ghalichi, H. Badri Ghavifekr; Dual Comb Unit High-g Accelerometer Based on CMOS-MEMS Technology, Sensors and Transducers, Vol. 103, Issue 4, April 2009

3                   M. Baghelani, H. Badri Ghavifekr; New Design of RF MEMS Disk Resonators and Optimization for Spurious Modes, European Conference on Circuit Theory and Design ECCTD09, Antalya, Turkey, 2009


Old Publications:

1                    R. Ehrlich, K.-F. Becker, H. Badrighavifekr, F. Ansorge, R. Aschenbrenner, H.Reichl, K. Sawai, A. Tanaka, K. Kumano, Y. Tenya, M. Cichon, H.Hosokawa; Reliability Aspects of Molded BGA's related to Material Properties, Proc. EuPac 98, Nuremberg, Germany

2                    F. Ansorge, H. Badrighavifekr, E. Jung, J. Kloeser, E. Zakel, H. Reichl; Reliability of COB Technology: A Comparison of Chip and Wire and Flip Chip Assembly; in Proc. Microsystem Technologies, 1996, Potsdam, Germany

3                    J. Auersperg, H. Badrighavifekr, E. Kieselstein, T. Winkler, A. Schubert, B.Michel; Fracture and Damage Investigations Enhancing the Thermo-Mechanical Reliability of Plastic Packages; Poly 99, Applications, Paris, France, Dec. 12-15, 1999, EEP-Vol. 27

4                    J. Auersperg, H. Badrighavifekr, E. Kieselstein, A. Schubert, B.Michel; Interface Toughness Evaluation for Flip Chip and CSP Assemblies based on Fracture Mechanics Approaches; EMRS-Meeting 2001, Strasbourg, France, June 5-8, 2001

5                    H. Badri Ghavifekr, B. Michel; Generalized Fracture Mechanical Integral Concept JG Applied to SMT Components. Materials Week, Int. Conf. on Advanced Materials, their Processes and Application, Munich, 2001

6                    H. Badri Ghavifekr, B. Michel; Generalised Fracture Mechanical Integral Concept JG and its Application in Microelectronic Packaging Technology, Sensors and Actuators A99, Elsevier, 2002, p 183-187

7                    H. Badri Ghavifekr, B. Michel; Application of the Generalized Fracture Mechanical Integral Concept JG in Microelectronic Packaging Technology. Materials Week, Int. Conf. on Advanced Materials, their Processes and Application, Munich, 2002

8                    H. Badri Ghavifekr; Einsatz bruchmechanischer Integralkonzepte zur Zuverlaessigkeitsbewertung in der mikroelektronischen Aufbau- und Verbindungstechnik. Dissertation, Technical University Berlin, Feb. 2004,

                  http://edocs.tu-berlin.de/diss/2004/badri_habib.htm
       
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