PHD. Electrical Engineering
Feb. 2004 Berlin University of Technology / Germany
1 R. Ehrlich, K.-F. Becker, H. Badrighavifekr, F. Ansorge, R. Aschenbrenner, H.Reichl, K. Sawai, A. Tanaka, K. Kumano, Y. Tenya, M. Cichon, H.Hosokawa; Reliability Aspects of Molded BGA's related to Material Properties, Proc. EuPac 98, Nuremberg, Germany
2 F. Ansorge, H. Badrighavifekr, E. Jung, J. Kloeser, E. Zakel, H. Reichl; Reliability of COB Technology: A Comparison of Chip and Wire and Flip Chip Assembly; in Proc. Microsystem Technologies, 1996, Potsdam, Germany
3 J. Auersperg, H. Badrighavifekr, E. Kieselstein, T. Winkler, A. Schubert, B.Michel; Fracture and Damage Investigations Enhancing the Thermo-Mechanical Reliability of Plastic Packages; Poly 99, Applications, Paris, France, Dec. 12-15, 1999, EEP-Vol. 27
4 J. Auersperg, H. Badrighavifekr, E. Kieselstein, A. Schubert, B.Michel; Interface Toughness Evaluation for Flip Chip and CSP Assemblies based on Fracture Mechanics Approaches; EMRS-Meeting 2001, Strasbourg, France, June 5-8, 2001
5 H. Badri Ghavifekr, B. Michel; Generalized Fracture Mechanical Integral Concept JG Applied to SMT Components. Materials Week, Int. Conf. on Advanced Materials, their Processes and Application, Munich, 2001
6 H. Badri Ghavifekr, B. Michel; Generalised Fracture Mechanical Integral Concept JG and its Application in Microelectronic Packaging Technology, Sensors and Actuators A99, Elsevier, 2002, p 183-187
7 H. Badri Ghavifekr, B. Michel; Application of the Generalized Fracture Mechanical Integral Concept JG in Microelectronic Packaging Technology. Materials Week, Int. Conf. on Advanced Materials, their Processes and Application, Munich, 2002
8 H. Badri Ghavifekr; Einsatz bruchmechanischer Integralkonzepte zur Zuverlaessigkeitsbewertung in der mikroelektronischen Aufbau- und Verbindungstechnik. Dissertation, Technical University Berlin, Feb. 2004,
http://edocs.tu-berlin.de/diss/2004/badri_habib.htm